New Advanced Circuit Board Assembly Equipment

Introduction

At MicroType Engineering, we pride ourselves on staying at the forefront of technological innovation in electronics design and assembly. Our commitment to high-quality, high-reliability, and precision is unwavering. In our continuous pursuit of excellence, we are excited to announce the acquisition of three new pieces of advanced circuit board assembly equipment: a Baron Blakeslee vapor degreaser, a MPM momentum printer with built-in Solder Paste Inspection (SPI), and a Nordson Dage 2.5D XRay machine. These additions not only expand our capabilities but also reinforce our dedication to delivering the best to our clients.

Baron Blakeslee Vapor Degreaser – Revolutionizing Circuit Board Cleaning

In the realm of electronics, the cleanliness of circuit boards is paramount. The Baron Blakeslee vapor degreaser stands as a testament to our commitment to precision and environmental responsibility. This state-of-the-art machine offers unparalleled cleaning efficiency, removing contaminants with ease and ensuring the highest degree of purity for our circuit boards.

How it Works

The vapor degreasing process utilized by the Baron Blakeslee model is a sophisticated method involving a specialized solvent vapor to clean the circuit boards. This process begins by heating the solvent in a boil sump, creating a vapor. As the vapor rises, it envelops the circuit boards, within the chamber. The vapor condenses upon contact with the cooler boards, dissolving and washing away impurities and contaminants. The contaminants are then carried away when the solvent vapor drips back into the boil sump, leaving behind a clean, dry, and residue-free circuit board.

This process is renowned for its ability to clean thoroughly, reaching into tiny crevices and under components where traditional aqueous cleaning methods might not be as effective. The precision of this method is particularly crucial for high-density circuit boards and components with intricate configurations.

Benefits for Our Clients

• Enhanced Cleaning Efficiency: This degreaser meticulously cleans every board. It’s particularly effective for removing flux residues, oils, and other contaminants that can impact the performance and longevity of electronic components. This high level of cleanliness is especially crucial for high-reliability applications like aerospace, medical devices, and military hardware, where even minor contaminants can lead to significant failures.
• Environmentally Friendly: Aligning with our green initiatives, this vapor degreasing method minimizes ecological impact. Unlike traditional methods that often require large amounts of water and generate wastewater, vapor degreasing uses a closed-loop system. This system not only reduces solvent consumption but also prevents the release of harmful emissions into the atmosphere.
• Improved Product Reliability: By ensuring a higher degree of cleanliness, vapor degreasing directly contributes to the reliability of the final product. Cleaner boards mean a lower likelihood of failures like short circuits, corrosion, and other issues that can arise from contaminants. This results in electronics that are not only more reliable in the short term but also have a longer overall lifespan.

Our vapor degreaser (left) and a diagram of the cleaning process (right): credit: www.machinedesign.com

MPM Momentum Printer with Built-in Solder Paste Inspection (SPI)

Solder paste application is a critical step in circuit board assembly. The MPM Momentum Printer, equipped with built-in SPI, sets a new standard in precision and efficiency. This advanced printer not only applies solder paste with exceptional accuracy but also inspects its own work, ensuring perfection at every step.

Advanced Features

The SPI feature allows for immediate inspection of the solder paste application. This real-time inspection reduces errors and enhances the overall quality of the soldering process.

Advantages for Production

• Increased Accuracy: With built-in inspection, the likelihood of solder defects is significantly reduced.
• Time Efficiency: Real-time inspection speeds up the production process by eliminating the need for separate inspection stages.
• Higher Quality Outputs: Consistently accurate solder paste application leads to higher quality final products.

Nordson Dage 2.5D XRay Machine – A New Era of Quality Assurance

The Nordson Dage 2.5D XRay machine represents the pinnacle of our quality assurance measures. This advanced machine is used for various inspection purposes, including first article inspection, BGA inspection, failure analysis, and in-process inspections.

Cutting-Edge Inspection Technology

The 2.5D XRay technology allows for detailed inspection of solder joints and internal components of circuit boards. This is especially crucial for Ball Grid Array (BGA) components, where traditional inspection methods fall short.

Impact on Quality Assurance

• Comprehensive Inspection: The ability to inspect internal components ensures that even the slightest defects are detected.
• BGA Inspection: Provides a detailed view of BGA solder joints, a critical aspect of modern circuit board design.
• Failure Analysis and Prevention: Helps in identifying potential points of failure, thereby preventing future issues.

An image from our XRay machine of a micro-BGA. Notice the copper pad within the outline of the solder balls and the minimal voiding present.

Conclusion

With the Baron Blakeslee vapor degreaser, the MPM Momentum Printer, and the Nordson Dage 2.5D XRay machine, MicroType Engineering elevates its capabilities to new heights. We are not just embracing the future of electronics assembly; we are actively shaping it. Our clients can expect unparalleled quality, reliability, and precision in every project we undertake.

We invite you to experience the MicroType Engineering difference. Contact us to learn more about our services or to discuss your next project. Let us help you achieve your electronic design and assembly goals with our enhanced capabilities.